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[Case Study] Improvement of Heat Dissipation and Bonding Strength of Substrates by Reducing Voids

Mounting the chip while scrubbing during solder melting! Examples of increased bonding strength and thermal conductivity.

We would like to introduce a case study on improving the heat dissipation and bonding strength of substrates through void reduction. To efficiently transfer the temperature during chip operation, we received an inquiry about using a high thermal conductivity material for the bonding between the plate and the base plate. By using a high thermal conductivity adhesive sheet, we improved the thermal conductivity. Additionally, by scrubbing the chip during solder melting, we successfully reduced the voids that were present inside the solder during the initial melting. 【Case Overview】 ■ Mounting Method: Flip Chip Mounting ■ Substrate Size: Plate 25mm x 25mm x 3mm, Base Plate 40mm x 40mm x 3mm ■ Substrate Material: Both the plate and base plate are aluminum (with Ni plating treatment on the entire surface) ■ Lot Quantity: A few pieces (for sampling) ■ Delivery Time: 1.5 months including preliminary evaluation *For more details, please refer to the PDF document or feel free to contact us.

• Company：イデアシステム
• Price：Other

• Circuit board design and manufacturing